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3374 fundamentals

Overview Statements Statistics Dividends Earnings Revenue

Key facts

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About

Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services. The company was founded on September 11, 1998 and is headquartered in Taoyuan, Taiwan.

Valuation

Fundamental metrics to determine fair value of the stock

Summary

No data available

There's currently no market capitalization, revenue or net income data to show.

Valuation ratios

Growth and Profitability

Company’s recent performance and margins

Dividends

Dividend yield, history and sustainability

3374 does not pay dividends

The company has not previously paid dividends and at the moment there is no information about whether it is going to pay them in the future

Financial health

Financial position and solvency of the company